What is the processing technology of silicon metal?
Silicon Metal refers to the application of silicon in industry. Silicon processing technology refers to the process of processing silicon materials into various required shapes and sizes. Common silicon processing includes cutting, grinding, polishing, coating, etc.
| Garde | Composition | ||||
| Si Content (%) | Impurities (%) | ||||
| Fe | Al | Ca | P | ||
| Silicon Metal 1501 | 99.69 | 0.15 | 0.15 | 0.01 | ≤0.004% |
| Silicon Metal 1502 | 99.68 | 0.15 | 0.15 | 0.02 | ≤0.004% |
| Silicon Metal 1101 | 99.79 | 0.1 | 0.1 | 0.01 | ≤0.004% |
| Silicon Metal 2202 | 99.58 | 0.2 | 0.2 | 0.02 | ≤0.004% |
| Silicon Metal 2502 | 99.48 | 0.25 | 0.25 | 0.02 | ≤0.004% |
| Silicon Metal 3303 | 99.37 | 0.3 | 0.3 | 0.03 | ≤0.005% |
| Silicon Metal 411 | 99.4 | 0.4 | 0.1 | 0.1 | ≤0.005% |
| Silicon Metal 421 | 99.3 | 0.4 | 0.2 | 0.1 | – |
| Silicon Metal 441 | 99.1 | 0.4 | 0.4 | 0.1 | – |
| Silicon Metal 551 | 98.9 | 0.5 | 0.5 | 0.1 | – |
| Silicon Metal 553 | 98.7 | 0.5 | 0.5 | 0.3 | – |
| Off-Grade Silicon Metal | 96 | 2 | 1 | 1 | – |
Specification granularity: natural block, 10-100mm, 10-60mm, 3-10mm, 1-3mm, 0-1mm, or customized according to customer requirements.
Packaging: Ton bag packaging (1000kg/bag) or customized according to customer requirements.
Silicon processing technology mainly includes the following steps:
1. Cutting: Silicon materials usually exist in the form of crystals and need to be cut into appropriate shapes and sizes. Common cutting methods include wire cutting, cutting, etc.
2. Grinding: The cut surface of silicon materials is usually rough and needs to be polished to make its surface smooth. The grinding process usually uses grinding machinery and grinding fluid.
3. Polishing: After grinding, the surface of silicon materials may still have tiny flaws and unevenness, which need to be polished. Polishing can improve the surface finish and brightness of silicon materials.
4. Cleaning: After completing the above processes, silicon materials need to be cleaned to remove oil and impurities on the surface to ensure the quality of the product.
5. Coating: Sometimes, in order to increase the function and service life of silicon materials, their surface can be coated. Coating can improve the wear resistance, corrosion resistance and optical properties of silicon materials.
The above are common steps in silicon processing technology, but the specific processing technology will vary depending on the application field, product requirements and the performance of silicon materials. For example, the processing technology of silicon wafers is for the field of semiconductor manufacturing, and mainly includes process steps such as cutting into wafers, chemical mechanical polishing, cleaning and thin film coating. The processing technology of silicon optical components pays more attention to the optical properties and precision of the surface, and requires high-precision grinding and polishing processes.
In general, silicon processing technology is a complex process that requires comprehensive consideration of the performance characteristics, processing flow and product requirements of silicon materials, and through scientific and reasonable process methods, accurate processing of silicon materials can be achieved to meet the needs of various industrial fields.